Resistive random-access memory technology is finding more interest and support after years of slow adoption. "ReRAM is a fit for some low-end MCUs and consumer products with a lower memory density requirement," said Yau Kae Sheu of UMC.
MediaTek and mobile phone maker Huawei Technologies are collaborating on the development of chipsets and other products in preparation for 5G wireless networks. The chip design company reports it has come up with a 5G terminal prototype that meets the specifications of 3GPP's proposed 5G standard.
GlobalFoundries wants the European Commission to initiate an investigation into the business practices of Taiwan Semiconductor Manufacturing Co., the world's largest silicon foundry, Reuters reports, citing an industry source. IC Insights estimates that TSMC held 58% of the foundry market last year.
Rensselaer Polytechnic Institute and Cornell University researchers report rechargeable batteries could last longer and be more powerful by using indium-coated lithium electrodes. The indium layer around the lithium electrode promotes better interaction between the electrode and the electrolyte, the research team says.
Ultrathin layers of semiconductor materials should be grown, not deposited atop each other, to make stacks that are only a few atoms in thickness, say researchers at the University of Chicago and Cornell University. The team says its stacked films are compatible with water or plastic surfaces, detachable and suspendable.
Imagination Technologies has introduced the PowerVR 2NX Neural Network Accelerator intellectual property that could be used in system-on-a-chip designs for artificial intelligence applications. The company also debuted the PowerVR Series9XE and PowerVR Series9XM graphics processing units.
Four industry experts from Dai Nippon Printing, Applied Materials, KLA-Tencor and D2S were interviewed about the technical challenges facing photomasks. One issue is the complexity of making mask blanks for use in extreme ultraviolet masks, said Weston Sousa of KLA-Tencor.
Intel's 10-nanometer "Cannon Lake" processors, once expected for release in 2015, will hit the market before the end of this year, offering improved transistor performance and transistor density, the company said at an event in Beijing. It also disclosed plans for the next-generation "Falcon Mesa" field-programmable gate arrays, which will be fabricated with a 10nm process.
Rambus reports it has working silicon in its laboratories for DDR5, the pending JEDEC standard memory interface. Volume production of DDR5 memory chips is expected in 2019, after JEDEC completes the memory interface specification by next June.
Western Digital has asked the International Court of Arbitration to head off Toshiba's plan to build a new wafer fabrication facility in Yokkaichi, Japan, without any input or investment by SanDisk, a WD subsidiary and Toshiba's long-standing partner in making NAND flash memory devices.
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