Semiconductors
Top stories summarized by our editors
11/22/2017

Indian Institute of Science Bangalore researchers report combining graphene with quantum dots to produce brighter, more energy-efficient displays for next-generation mobile devices and televisions. The hybrid display technology could also be used in photo detectors and sensors, researchers say.

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mobile devices
11/22/2017

More than 85% of the components needed for China's defense and high-tech systems are now produced in China, the Ministry of Industry and Information Technology reports. "China is now fully capable of producing secure and reliable advanced electronic components, and will rely even less on imports," said Diao Shijing, the ministry's director of information technology.

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China Daily (Beijing)
11/22/2017

Components from both STMicroelectronics and Soitec are represented in the Apple iPhone X model, signaling a new sense of triumph in France's electronics industry, Junko Yoshida writes. Soitec worked with CEA-Leti, imec and the Universite Catholique de Louvain in developing its latest silicon-on-insulator wafer technology.

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EE Times
11/22/2017

Broadcom says it will tape out its first designs for chips with 7-nanometer features during the fourth quarter. Deep learning and networking are the target applications for the chip company's semiconductor intellectual property, which will be fabricated with Taiwan Semiconductor Manufacturing Co.'s 7nm process.

11/22/2017

MediaTek Chairman Tsai Ming-kai predicted that Moore's Law will remain in effect during the 7-nanometer and 5nm process nodes. The 3nm process generation will likely present problems for the semiconductor industry's longstanding nostrum, he said Wednesday in a talk with Wang Jian, Alibaba Group's chief technology officer.

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DigiTimes
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Moore, Alibaba Group, MediaTek
11/21/2017

Intel issued an advisory on Monday, saying the Management Engine feature in its chips could be compromised by attackers, after cybersecurity researchers reported the flaw to the company. The vulnerability may be present in many new internet of things devices, PCs and servers.

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Wired online
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Intel
11/21/2017

Multiple startups are said to be working on high-resolution radar chips for automotive applications, planning to offer an alternative to LiDAR in automated driving, this analysis notes. "With the trend to autonomous driving progressing rapidly, the need for high-resolution radar is also increasing," said Michael Knebelkamp of NXP Semiconductors.

11/21/2017

The CoolMOS CFD7, a 600-volt metal-oxide-semiconductor field-effect transistor, is now in volume production at Infineon Technologies. The MOSFET can be used in switched-mode power supplies for electric vehicle charging stations, servers and telecommunications equipment.

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Infineon Technologies
11/21/2017

Arm and Nano Global are collaborating on a chip design that could recognize and analyze pathogens, along with other living organisms. The resulting chip, expected to be available in 2020, will involve artificial intelligence, blockchain authentication, edge computing, nanotechnology and optics.

11/21/2017

Maxim Integrated Products has introduced the DS28E38 DeepCover secure authenticator, a partner security chip to be used alongside microcontrollers for internet of things devices. The DS28E38 has Maxim's ChipDNA physically uncloneable function, providing on-die security keys.

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Maxim Integrated Products