Microsemi's PolarFire Evaluation Kit is specified to optimize power consumption by the company's flash-based PolarFire field-programmable gate arrays. The kit is carried by Mouser Electronics, a distributor of electronic components.
Intel has brought out four new quad-core laptop chips with the eighth-generation Kaby Lake architecture, two Core i7 processors and two Core i5 processors. This generation will be initially be fabricated with the 14-nanometer+ Kaby Lake architecture, while future chips will be made with the 14-nm++ Coffee Lake and 10-nm Cannonlake architectures.
GlobalFoundries, United Microelectronics, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. each intend to offer spin-transfer torque MRAM as an embedded memory technology before the close of 2017. MRAM is expected to surpass NOR flash memory as the leading embedded memory technology.
Phillip LoPresti, president and CEO of Everspin, discusses spin torque magnetoresistive random-access memory technology in this interview. "MRAM is a nonvolatile memory that provides the aspects of a working memory like SRAM and DRAM," he says.
The Trump administration's executive order mandating a government investigation into intellectual property theft is chiefly aimed at China, while Korea doesn't have as much of a problem with US chipmakers, this analysis notes. The acquisition of Xcerra, a supplier of semiconductor testing equipment, by a Chinese government-controlled investment fund may be in jeopardy if the US government sees national security issues involved.
DRAMeXchange reports the tight supply conditions for DRAMs lessened during the second quarter, in comparison with the first quarter of 2017. Worldwide DRAM sales grew 16.9% in Q2 to $16.5 billion, the market-research firm estimates, as average selling prices for PC and server DRAMs were up more than 10% from Q1.
University of Illinois at Urbana-Champaign researchers report developing an alternative method for separating a layer of graphene from its substrate without using chemicals that leave behind a residue in the process. This could promote the use of clean graphene in flexible transparent electronics, they say.
The introduction of the next-generation iPhone will answer a question: Did STMicroelectronics provide the Apple handset's near-field communication chip, or did the incumbent supplier, NXP Semiconductors, prevail in the design? The pending acquisition of NXP by Qualcomm may have been a factor in Apple's choice of NFC chips, Junko Yoshida writes.
Semiconductor manufacturers are concerned about quality issues in process-critical components for their wafer fabrication equipment, as a bad part could affect chip yields, Mark LaPedus writes. Norm Armour of Micron Technology says, "Sub-components have a major impact in facility systems, which in turn affects fab equipment performance."
Nvidia displaced MediaTek as the third-largest IC design company in the world, measured by revenue, during the second quarter, the Topology Research Institute reports. MediaTek and Marvell Semiconductor posted second-quarter revenue that was down from a year earlier, the institute notes.