Semiconductors
Top stories summarized by our editors
12/13/2017

JEDEC is the global leader in developing standards for the microelectronics industry, bringing together thousands of member company volunteers in over 100 technical committees and task groups to meet the needs of every segment of the industry. JEDEC is pleased to extend a warm welcome to new member companies Anpec Electronics Corporation, GaN Systems, Hefei Core Storage Electronic Limited, Hirex Engineering, VisIC and Wolfspeed, a Cree Company. Interested in JEDEC membership for your company? Find out more and join today.

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jedec.org
12/12/2017

As demand for smart speakers is expected to reach 30 million to 50 million units in 2018, those in the integrated circuit category are seeking ways to take advantage of that. Chipmaker MediaTek is one company benefiting from the rise of smart speaker popularity, gaining orders from Google, Amazon and Alibaba to provide necessary chips for the devices.

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DigiTimes
12/12/2017

Elliott Management, an activist hedge fund that holds roughly 6% of NXP Semiconductors' shares, believes Qualcomm should pay $135 a share for acquiring NXP, which is more than the $110 a share the two chip companies agreed upon last year. The new battlefront comes as Qualcomm is facing a hostile takeover bid from Broadcom, which has proposed to replace Qualcomm's board at the annual meeting in March.

12/12/2017

BMW i Ventures and Delta Group Electronics have invested in GaN Systems, which provides gallium nitride-based power semiconductors for industrial motors, notebook travel adapters and servers. The Ottawa, Canada-based chip company will use the funding to accelerate product development and to expand worldwide sales.

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GaN Systems, BMW i Ventures, BMW
12/12/2017

Redpine Signals brought out the RS14100, a multiprotocol wireless microcontroller, which is said to have a Wi-Fi standby associated power of less than 50 microamperes. The MCU is based on an Arm Cortex-M4F core and is fabricated with a 40-nanometer process.

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New Electronics
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Redpine Signals, Wi-Fi
12/12/2017

Toshiba is sampling embedded NAND flash memory devices that comply with JEDEC's Universal Flash Storage release 2.1 standard. The embedded memory chips are meant for automotive applications and meet AEC-Q100 Grade 2 requirements.

12/12/2017

Matrix multiplication, an operation of conventional neural networks, could be realized by using a crossbar array with elements of resistive RAM or phase-change memory at the intersections of column and row electrodes, this analysis notes. One example of what is needed is IBM's TrueNorth processor, which has 1 million neurons and 256 million synapses.

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IBM
12/12/2017

The new JC-70 committee will initially have two subcommittees: Gallium Nitride (GaN) and Silicon Carbide (SiC) and will focus on Reliability and Qualification Procedures; Datasheet Elements and Parameters; and Test and Characterization Methods. Interested companies worldwide are welcome to join JEDEC to participate in this important standardization effort. JC-70 will next meet on Jan. 25, 2018 and on March 5, 2018. Visit the JEDEC website for more information.

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jedec.org
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JEDEC, JEDEC, Silicon Carbide
12/11/2017

Advanced Micro Devices CEO Lisa Su called for closer collaboration in the semiconductor industry to realize the next generation in computing technology. "The next level of computing power, especially for consumers, is really around immersive computing and the idea that we all have many, many devices connected to us," she said in a keynote address at the IEEE International Electron Devices Meeting in San Francisco.

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EE Times
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Lisa Su, AMD
12/11/2017

Trendforce estimates China's IC design companies will realize total revenues of $30 billion this year, while forecasting 2018 revenues of $36 billion. Leading design houses in China are aiming at artificial intelligence and 5G wireless communications, with less growth seen at firms focusing on low-end and midrange smartphone chips.