Semiconductors
Top stories summarized by our editors
8/21/2017

Microsemi's PolarFire Evaluation Kit is specified to optimize power consumption by the company's flash-based PolarFire field-programmable gate arrays. The kit is carried by Mouser Electronics, a distributor of electronic components.

Full Story:
Electronics360
More Summaries:
Microsemi, Mouser Electronics
8/21/2017

Intel has brought out four new quad-core laptop chips with the eighth-generation Kaby Lake architecture, two Core i7 processors and two Core i5 processors. This generation will be initially be fabricated with the 14-nanometer+ Kaby Lake architecture, while future chips will be made with the 14-nm++ Coffee Lake and 10-nm Cannonlake architectures.

Full Story:
ZDNet, Fortune
More Summaries:
Intel
8/21/2017

GlobalFoundries, United Microelectronics, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. each intend to offer spin-transfer torque MRAM as an embedded memory technology before the close of 2017. MRAM is expected to surpass NOR flash memory as the leading embedded memory technology.

8/18/2017

Phillip LoPresti, president and CEO of Everspin, discusses spin torque magnetoresistive random-access memory technology in this interview. "MRAM is a nonvolatile memory that provides the aspects of a working memory like SRAM and DRAM," he says.

More Summaries:
Everspin Technologies, Everspin
8/18/2017

The Trump administration's executive order mandating a government investigation into intellectual property theft is chiefly aimed at China, while Korea doesn't have as much of a problem with US chipmakers, this analysis notes. The acquisition of Xcerra, a supplier of semiconductor testing equipment, by a Chinese government-controlled investment fund may be in jeopardy if the US government sees national security issues involved.

More Summaries:
Trump administration, Xcerra
8/18/2017

DRAMeXchange reports the tight supply conditions for DRAMs lessened during the second quarter, in comparison with the first quarter of 2017. Worldwide DRAM sales grew 16.9% in Q2 to $16.5 billion, the market-research firm estimates, as average selling prices for PC and server DRAMs were up more than 10% from Q1.

Full Story:
EE Times
8/18/2017

University of Illinois at Urbana-Champaign researchers report developing an alternative method for separating a layer of graphene from its substrate without using chemicals that leave behind a residue in the process. This could promote the use of clean graphene in flexible transparent electronics, they say.

More Summaries:
University of Illinois
8/18/2017

The introduction of the next-generation iPhone will answer a question: Did STMicroelectronics provide the Apple handset's near-field communication chip, or did the incumbent supplier, NXP Semiconductors, prevail in the design? The pending acquisition of NXP by Qualcomm may have been a factor in Apple's choice of NFC chips, Junko Yoshida writes.

Full Story:
EE Times
8/18/2017

Semiconductor manufacturers are concerned about quality issues in process-critical components for their wafer fabrication equipment, as a bad part could affect chip yields, Mark LaPedus writes. Norm Armour of Micron Technology says, "Sub-components have a major impact in facility systems, which in turn affects fab equipment performance."

More Summaries:
Micron Technology, Mark LaPedus
8/17/2017

Nvidia displaced MediaTek as the third-largest IC design company in the world, measured by revenue, during the second quarter, the Topology Research Institute reports. MediaTek and Marvell Semiconductor posted second-quarter revenue that was down from a year earlier, the institute notes.

Full Story:
DigiTimes