Broadcom posted net income of $691 million for its fiscal second quarter, with revenue declining 4.7% to $5.52 billion, compared with a year earlier. The chipmaker blamed "a broad-based slowdown in the demand environment," ascribing it to "geopolitical uncertainties, as well as the effects of export restrictions on one of our largest customers."
John Sell, who led the design of system-on-a-chip devices for Microsoft's Xbox One console and other projects, left that position last month to become an Intel Fellow, reporting directly to Raja Koduri, senior vice president of the chipmaker's Core and Visual Computing Group. Prior to spending 14 years in chip design for Microsoft, Sell worked for Apple and 3DO.
Third Point, an activist hedge fund led by Daniel Loeb, is once again demanding that Sony should spin off its entertainment and semiconductor business lines into separate companies. The hedge fund also wants the Japanese conglomerate to sell its equity stakes in Sony Financial Holdings, M3 Inc., Olympus Corp. and Spotify Technology.
The collaboration seen in open-source projects should be implemented in developing the graphene 2D material, Don Basile writes. "As it stands, graphene research is limited to a select few technology companies -- Samsung, for instance, has the most graphene patents to date," he notes.
Researchers at Harvard's John A. Paulson School of Engineering and Applied Sciences report being able to have a laser emit encoded microwaves as radio-frequency signals, modulate those signals, and receive those microwaves as external RF signals. The research team used a quantum cascade laser with a semiconductor laser frequency comb.
The digital components in a chip design were once immune to noise problems, yet that given is eroding now, this analysis notes. "As you follow Moore's Law, the voltage levels keep getting closer to the threshold level, which means that the amount of room you have to buffer your signal from the noise ripple gets smaller and smaller as the signal-to-noise ratio goes up," says Marc Swinnen of Cadence Design Systems.
Intel's wafer fabrication facility in Rio Rancho, N.M., is at the forefront of semiconductor technology in developing silicon photonics components, this analysis notes. The site's headcount, which dwindled from 3,300 in 2013 to 1,100 in 2017, now stands at 1,200 with plans to fill 300 more positions.
Qualcomm is fulfilling its commitment to open more facilities in Taiwan under a 2018 legal settlement. Projects reportedly include a building in Hsinchu focusing on 5G cellular communications technology that sources say will be close to where Taiwan Semiconductor Manufacturing Co. will put up a wafer fab to make chips with 2-nanometer features.
One-quarter of Foxconn's production capacity is located outside of China, enabling the contract electronics manufacturer to deal with supply chain disruptions in the US-China trade war, says Liu Yang-wei, general manager of the firm's semiconductor sub-group. Customers have not requested relocating production from China so far, he notes.
Researchers at Carnegie Mellon University report development of a semi-liquid lithium metal-based anode that could prove useful in next-generation battery design. "Incorporating a metallic lithium anode into lithium-ion batteries has the theoretical potential to create a battery with much more capacity than a battery with a graphite anode," said Krzysztof Matyjaszewski, a CMU professor.
- Page 1