Advanced Micro Devices and Intel will present significant competition to Nvidia in the discrete graphics card market beginning in 2021, upstream supply chain sources say. AMD is said to be turning to Taiwan Semiconductor Manufacturing Co. to fabricate its 7-nanometer Navi graphics card series, while Intel will manufacture its graphics processing units, those sources note.
Shenzhen Goodix Technology agreed to acquire the assets of the voice and audio solutions business at NXP Semiconductors. The deal involves employees and intellectual property assets designed to extend the reach of Goodix in the internet of things and mobile.
Tokyo is allowing shipments of photoresist to Samsung Electronics so the Korean chipmaker can continue producing advanced logic ICs with extreme ultraviolet lithography technology. Together with an earlier shipment, Samsung will have enough resist for nine months of semiconductor manufacturing.
Micron Technology brought out a high-capacity 16-gigabit monolithic LPDDR4X DRAM meant for mobile devices. "Data-intensive mobile applications are driving the growth in consumer demand for high-capacity memory and storage -- not just in flagship smartphones but also in mid- to high-end mobile devices," said Raj Talluri of Micron's Mobile Business Unit.
Cerebras Systems introduced the Wafer Scale Engine with 1.2 trillion transistors for artificial intelligence applications. While most microchips are typically diced up from 12-inch silicon wafers, the startup's processor features 400,000 cores on 42,225 square millimeters, significantly bigger than Nvidia's 815-square-millimeter graphics processing unit with 21.1 billion transistors.
Computer-on-module performance will get a substantial boost with industry implementation of the COM-HPC module specification for high-performance computing. Multiple companies involved in the PCI Industrial Computer Manufacturers Group are together working on the COM-HPC spec, this analysis notes.
The establishment of 5G wireless networks will create continuing demand for gallium nitride radio-frequency components and power amplifiers, industry sources say. Advanced Wireless Semiconductor, Global Communications Semiconductor, Visual Photonics Epitaxy and Win Semiconductors are among the component vendors expected to benefit from the long-term growth for GaN-based chips, those sources note.
Stanford University researchers report crafting a heat shield for electronic devices using graphene and other 2D materials to form a four-layered insulator that is 10 atoms in thickness. "We're looking at the heat in electronic devices in an entirely new way," said Eric Pop, a professor of electrical engineering.
SK Hynix brought out the Gold S31 2.5-inch SATA drive, marking the chip company's return to the retail solid-state drive market. The SSDs can store 256 gigabytes to 1 terabyte of data.
While 2.5D ICs, chiplets and other advanced packaging technologies continue to proliferate, the semiconductor smorgasbord grows even more complicated, this analysis notes. Johanna Swan of Intel says, "Customers want tools, which don't exist today, and this is not one size fits all."
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