Semiconductors
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4/19/2019

Nvidia signed a memorandum of understanding with Taiwan's National Applied Research Laboratories on developing an autonomous driving technology program, using the chip company's Drive Constellation and Drive Sim platforms in the new Taiwan Car Lab. The Ministry of Science and Technology will work to cultivate an autonomous driving ecosystem in Taiwan, taking in academic research groups, local firms and startups.

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DigiTimes
4/19/2019

Huaxintong Semiconductor, a joint venture established in 2016 between China's Guizhou province and Qualcomm, will shut down by the end of this month, The Information reports, citing employees of venture. HXT was developing chips for servers.

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Reuters
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Qualcomm, Guizhou
4/19/2019

University of California at San Diego researchers report developing a method to recycle the cathodes of lithium-ion batteries and regenerate those degraded cathodes. "This work presents a solution to reclaim the values of end-of-life lithium-ion batteries after 5-10 years of operation," said Zheng Chen, a professor at UC San Diego.

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New Electronics
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University of California
4/19/2019

Graphcore, a semiconductor startup in Bristol, UK, is shipping its intelligence processing unit to early-access customers for artificial intelligence acceleration. CEO Nigel Toon claim his company's processor is better-suited for AI applications than graphics processing units.

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EE Times, EE Times
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AI, Nigel Toon, Graphcore
4/19/2019

Developers and manufacturers of ICs with features of 7 nanometers or 5nm can now choose among high numerical aperture extreme ultraviolet lithography, multi-beam direct-write lithography and nanoimprint lithography, Mark LaPedus writes. The semiconductor industry is also working with complementary patterning techniques, such as directed self-assembly and self-aligned techniques, he notes.

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7 nanometers, Mark LaPedus
4/19/2019

The increasing complexity of IC packaging is causing technologists to turn to die sorting machines, which are capable of inspecting packaged chips at high speed, this analysis notes. "We see a need for precise inspection on all package types, as almost all are going through a dicing process for singulation," says Gerald Steinwasser of Muhlbauer, a vendor of die-sorting systems.

4/18/2019

Six industry experts discuss electronic design automation's role in implementing artificial intelligence technology in this roundtable interview. "EDA has to tackle the areas of uncertainty so that you can focus on the dataset," OneSpin Solutions CEO Raik Brinkmann said.

4/18/2019

SK Hynix has finished the expansion of a DRAM production line at its 300-millimeter wafer fabrication facility in Wuxi, China. The $836 million C2F expansion project resulted in a single-floor fab line space measuring more than 62,000 square feet.

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SK Hynix
4/18/2019

ASE Technology is said to be seeing an increase in customized system-in-package backend orders due to demand for 5G chips, industry sources say. The Apple-Qualcomm legal settlement means Apple will resume buying Qualcomm chips for new iPhone models, and SiP technology will be crucial to packaging the components, those sources note.

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DigiTimes
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ASE, Qualcomm, Apple
4/18/2019

Toshiba America Business Solutions reports recycling more than 229 metric tons of electronic waste in 2018, a record for the company. Toshiba started working with the Close the Loop recycling organization in 2008 and has kept more than 1,229 metric tons of e-waste out of landfills during the past decade.

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EPPM magazine online
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Toshiba